扁平框架安装微型翘板开关图片展示:
3YCM系列扁平框架安装微型翘板开关规格：
特色:多段數,帽子和端子有多樣化的選,端子点胶能预防在焊锡时汙染物
应用范围:電信,仪器.测试设备,医疗设备.
功率：取决于触点材料(5A@120VAC和28VDC 2A@250VAC/最大0.4VA@最高20VAC/DC）
机械寿命：40000次操作以上
接触电阻：在2-4VDC,100mA时，镀银于镀金触点
的最大电阻为10毫欧。
绝缘电阻：最小1000兆欧
绝缘强度：触点间最低1000VAC至少一分钟，在触点与
外壳之间最低1000VAC至少一分钟
工作温度范围：-30度到85度
材质
外壳：苯二酸二烯丙酯树脂（UL94V-0)
翘板：尼龙，黑色
铜头：黄铜镀镍
框架：不锈钢
支撑支架：铜镀锡
端子/弹片：铜镀银或镀金
焊锡条件
手工焊：用烙铁30瓦，控制在350℃,约5秒，同时应用焊料.
波峰焊：推荐焊接温度：260±5℃
锡侵泡时间：最多5秒.(PCB板的厚度为1.6mm)
焊接：波峰炉
3YCM系列扁平框架安装微型翘板开关英文规格：
SPECIFICATIONS
CONTACT RATING: Dependent upon contact material.
MECHANICAL LIFE: 40,000 make-and-break cycles.
CONTACT RESISTANCE: 10 mȟġmax. initial @ 2-4VDC
100mA for both silver and gold plated contacts.
INSULATION RESISTANCE: 1,000 Mȟġmin.
DIELECTRIC STRENGTH: 1,000 Vrms min.@sea level.
OPERATING TEMPERATURE: -30°C to 85°C.
MATERIALS
CASE: Diallyl phthalate (DAP) (UL94v-0).
ACTUATOR: Nylon,black std.
BUSHING: Brass or Zinc,nickel plated.
HOUSING: Stainless Steel.
SWITCH SUPPORT: Brass,tin plated.
TERMINAL/CONTACT: Brass,with silver or gold plated.
SOLDERING PROCESSES
MANUAL SOLDERING: Use soldering iron of 30 watts, controlled at 350°C
approximately 5 seconds while applying solder.
WAVE SOLDERING: Recommended Soldering Temperature: 260 ± 5°C
Duration of Solder Immersion: Max 5 sec. (PCB is 1.6mm in thickness)
